PCB Manufacturing Capacity:
|
Item |
Specification |
|
Material |
FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc. |
|
Remarks |
High Tg CCL is Available(Tg>=180℃) |
|
Finish Board Thickness |
0.2 mm-6.00mm(8mil-126mil) |
|
Surface Finish |
Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
|
Shape |
Routing、Punch、V-cut、Chamfer |
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Surface Treatment |
Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA) |
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Silkscreen(black, yellow, white) |
|
|
Peel able-mask(red, blue, thickness>=300um) |
|
|
Minimum Core |
0.075mm(3mil) |
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Copper Thickness |
1/2 oz min; 12oz max |
|
Min Trace Width & Line Spacing |
0.075mm/0.075mm(3mil/3mil) |
|
Min Hole Diameter for CNC Drilling |
0.1mm(4mil) |
|
Min Hole Diameter for Punching |
0.6mm(35mil) |
|
Biggest panel size |
610mm * 508mm |
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Hole Position |
+/-0.075mm(3mil) CNC Drilling |
|
Conductor Width(W) |
+/-0.05mm(2mil) or +/-20% of original |
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Hole Diameter(H) |
PTHL:+/-0.075mm(3mil) |
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Non PTHL:+/-0.05mm(2mil) |
|
|
Outline Tolerance |
+/-0.1mm(4mil) CNC Routing |
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Warp & Twist |
0.70% |
|
Insulation Resistance |
10Kohm-20Mohm |
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Conductivity |
<50ohm |
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Test Voltage |
10-300V |
|
Panel Size |
110 x 100mm(min) |
|
660 x 600mm(max) |
|
|
Layer-layer misregistration |
4 layers:0.15mm(6mil)max |
|
6 layers:0.25mm(10mil)max |
|
|
Min spacing between hole edge to circuitry pattern of an inner layer |
0.25mm(10mil) |
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Min spacing between board outline to circuitry pattern of an inner layer |
0.25mm(10mil) |
|
Board thickness tolerance |
4 layers:+/-0.13mm(5mil) |
Ceramic PCB Tech Specification:
Item
Test Condition
Unit
Senior
Material
Aluminium nitride Ceramic /Alumina 99.5%/Alumina 99%
Color status
average crystal size
μm
3-5
volume density
g/cm³
≧3.74
water absorption
%
0
Vickers hardness
Load 4.9
Gpa
≧15
flexural Strength
Bending moment 80mm
Mpa
≧324
Linear Coefficient of Thermal Expansion
20-500℃
20-800℃
1×10-
˚mm/℃
605-7.5
6.5-8.0
thermal conductivity
20℃
W(m-k)
≧170
Dielectric intensity
Kv/mm
≧12
Volume Resistance
20℃
300℃
500℃
Ω-cm
≧1014
≧1011
≧109
Dielectric Constant
1MHz
9.3-10.6
dielectric loss
1MHz
3×10-4
Thermal - shock
850℃
times
≧7
roughness of the surface
Ra(λ2)
μm
0.20-0.75
FPC Tech Specification
|
Items |
Capabilities |
|
Layers |
FPC：1 to 6 Layers,Rigid Flex：2 to 10 Layers |
|
Regular Base Materials |
Kapton,Polyimide（PI）,Polyester（PET） |
|
Base Copper Thickness |
1/3 oz to 2oz |
|
Regular Base Material Thickness |
12.5um to 50um（FPC） |
|
0.1mm to 3.2mm（Rigid） |
|
|
Regular Coverlay Thickness |
27um to 50um |
|
Regular Adhesive Thickness |
12um to 25um |
|
Blind or Buried Vias |
Yes |
|
Impedance Control |
Yes |
|
Min.Line Width/Spacing |
0.04mm/0.04mm |
|
Surface Finishing |
Electroplate Ni/Au（Flash gold/Soft gold/Hard gold）,ENIG,Immersion Tin; plated silver;immersion silver ; OSP,HASL |
|
Outline Fabrication |
Die cut,laser cut,CNC routing,V-scoring |
|
Hole to edge(Hard tool/Die Cut) |
±0.1/±0.2mm |
|
Edge to edge(Hard tool/Die Cut) |
±0.05/±0.2mm |
|
Circuit to edge(Hard tool/Die Cut) |
±0.07/±0.2mm |
Carbon Oil PCB Tech Specification
|
Handle PCB( PS2,XBOX.etc) |
|
|
Main technical parameter |
|
|
Rang of total resistance |
1KΩ-1MΩ |
|
Resistance tolerance: |
±20% |
|
Resistance to heat : |
260℃ ±5℃ ，5sec，△TR≤±50% |
|
Durability: |
1 Million cycles Min |
|
|
|
|
Automobile component(Use for windscreen wiper. light and air-condition) |
|
|
Main technical parameter |
K-1MΩ |
|
Resistance taper: |
linear |
|
Resistance tolerance: |
±1% |
|
Linearity tolerance: |
±1% |
|
Durability: |
I Million cycles Min |
|
TCR: |
with ±1000 PPM(-30℃--+70℃) |
|
|
|
|
Electricital Component in speed control,etc. |
|
|
Main technical parameter |
RΩ-3MΩ |
|
Resistance tolerance: |
±1% |
|
Linearity tolerance: |
±1% |
|
Durability: |
1 Million cycles Min |
Aluminum PCB Tech Specification
|
Item |
|
|
Type of Alum board |
single board, Insulation board, double sided board |
|
Finish Board Thickness |
0.4mm----- 3.0mm |
|
Copper Thickness |
1 OZ--6 OZ |
|
Min.Trace Width & Line Spacing |
0.15mm |
|
Biggest size |
120cm*60cm |
|
Type for surface treatment |
OSP.HASL, Immersion Gold ,Immersion Tin (lead free) |
|
OSP |
0.20-0.40um |
|
Thickness of Ni |
2.50-3.50um |
|
Thickness of Au |
0.05-0.10um |
|
Thickness of tin |
5-20um |
|
Thickness of immersion silver |
0.15-0.40um |
|
Thermal conductivity |
1.0W-----3.0W |
|
Dielectric Thickness |
50um-150um |
|
Thermal resistance |
0.05℃/W-1.7℃/W |
|
Minimum completed hole dimension |
±0.10mm |
|
Tolerance for Hole Diameter |
±0.075mm |
|
Minimum Drilling Hole Diameter |
φ0.8mm |
|
Mask between pins |
0.15mm-0.35mm |
|
Minimum spacing between Pad and Pad |
0.18mm-0.35mm |
|
Outline tolerance |
±0.10mm |
|
Minimum thickness for V-cut |
0.25mm |
|
Outside copper thickness |
18-105um |
|
Core copper thickness |
18-35um |