Contact Infomation

  • Ms. Bluesky
  • Tel: +86-0755-23050569
  • Mobile: +86-15919476409 
  • Email:sales@xdpcba.com
  • Factory Address:5A Floor, C2 Building, Hengfeng Industrial City,No.739, Zhoushi Road,
    Hezhou Community, Hangcheng Street, Baoan District, Shenzhen, China
  • Office address: 
    Room No.816,Unit A, Huafeng headquarters economic Building ,Baoyuan, Xixiang Street, Baoan District,Shenzhen,China 
Position:Home >> Technology >>  Specification
FPC Tech Specification
Items Capabilities
Layers FPC:1 to 6 Layers,Rigid Flex:2 to 10 Layers
Regular Base Materials Kapton,Polyimide(PI),Polyester(PET),FR4
Base Copper Thickness 1/3 oz to 8oz
Regular Base Material Thickness 12.5um to 50um(FPC)
0.1mm to 3.2mm(Rigid)
Regular Coverlay Thickness 27um to 50um
Regular Adhesive Thickness 12um to 25um
Blind or Buried Vias Yes
Impedance Control Yes
Min.Line Width/Spacing 0.04mm/0.04mm
Surface Finishing Electroplate Ni/Au(Flash gold/Soft gold/Hard gold),ENIG,HASL,Immersion Tin,O.S.P
Outline Fabrication Die cut,laser cut,CNC routing,V-scoring
Hole to edge(Hard tool/Die Cut) ±0.1/±0.2mm
Edge to edge(Hard tool/Die Cut) ±0.05/±0.2mm
Circuit to edge(Hard tool/Die Cut) ±0.07/±0.2mm

Aluminium Tech Specification
Type of Alum board  single board, Insulation board, double sided board
 Finish Board Thickness 0.4mm----- 3.0mm
Copper Thickness  1 OZ--6 OZ
Min.Trace Width & Line Spacing 0.15mm
Biggest size 120cm*60cm
Type for surface treatment  OSP.HASL, Immersion Gold ,Immersion Tin (lead free)
OSP  0.20-0.40um
Thickness of Ni 2.50-3.50um
Thickness of Au 0.05-0.10um
Thickness of  tin 5-20um
Thickness of immersion silver  0.15-0.40um 
Thermal conductivity  1.0W-----3.0W
 Dielectric Thickness 50um-150um
 Thermal resistance 0.05℃/W-1.7℃/W
Minimum completed hole dimension  ±0.10mm
Tolerance for Hole Diameter ±0.075mm 
Minimum Drilling Hole Diameter φ0.8mm
Mask between pins 0.15mm-0.35mm 
Minimum spacing between Pad and Pad 0.18mm-0.35mm
Outline tolerance ±0.10mm
Minimum thickness for V-cut  0.25mm
Outside copper thickness 18-105um
Core copperthickness 18-35um

PCB Manufacture Capacity
Item Specification
Material FR-4, FR2.Taconic, Rogers, CEM-1, CEM-3, Ceramic, Crockery, Metal-backed Laminate, etc. Aluminum
Remarks High Tg CCL is Available(Tg>=170℃)
Finish Board Thickness 0.2 mm-6.00mm(8mil-126mil)
Surface Finish Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)
Shape Routing、Punch、V-cut、Chamfer
Surface Treatment Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA)
Silkscreen(black, yellow, white)
Peel able-mask(red, blue, thickness>=300um)
Minimum Core 0.075mm(3mil)
Copper Thickness 1/2 oz min; 12oz max
Min Trace Width & Line Spacing 0.075mm/0.1mm(3mil/4mil)
Min Hole Diameter for CNC Drilling 0.1mm(4mil)
Min Hole Diameter for Punching 0.6mm(35mil)
Biggest panel size 610mm * 508mm
Hole Position +/-0.075mm(3mil) CNC Drilling
Conductor Width(W) +/-0.05mm(2mil) or +/-20% of original
Hole Diameter(H) PTHL:+/-0.075mm(3mil)
Non PTHL:+/-0.05mm(2mil)
Outline Tolerance +/-0.1mm(5mil) CNC Routing
Warp & Twist 0.70%
Insulation Resistance 10Kohm-20Mohm
Conductivity <50ohm
Test Voltage 10-300V
Panel Size 110 x 100mm(min)
660 x 600mm(max)
Layer-layer misregistration 4 layers:0.15mm(6mil)max
6 layers:0.25mm(10mil)max
Min spacing between hole edge to circuitry pattern of an inner layer 0.25mm(10mil)
Min spacing between board outline to circuitry pattern of an inner layer 0.25mm(10mil)
Board thickness tolerance 4 layers:+/-0.13mm(5mil)

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